In recent years, due to the rapid improvement of integrated circuits' integration level and assembly technology's rapid progress, printed circuit boards have brought revolutionary changes and progress in design, materials, production testing, etc.
The technical core of E-glass fibreglass fabric is a substantial increase in density, which makes the printed circuit board developed in the direction of fine wire technology, micro-hole technology, thin multi-layer board and buried blind hole structure diversification. Glass fibre electronic yarn and electronic cloth are the basic materials of the electronic industry. Copper-clad laminates are the basic materials of printed circuit boards.
The glass composition of the electronic grade glass fibre for CCL is E-glass of aluminoborosilicate; that is, the dielectric constant of the electrically insulating glass is an important parameter representing the electrical characteristics of the CCL. Currently, the dielectric constant of E-glass fibre for traditional CCL is 5.8~6.3.
Various glass fibres with low dielectric constants have been successfully developed abroad to improve the signal transmission speed of printed circuit boards and meet the high-speed computing needs of large electronic computers. Among them, the dielectric constant of D glass is 3.8~4.2, and the dielectric constant of Q glass. It is 3.5~3.8, and S and T glass, whose dielectric constant is 4.5~5.2. In addition, there is a high dielectric constant H glass with a dielectric constant of 11.6, which is conducive to making miniaturised printed circuit boards.
Electronic-grade glass fibre cloth for copper clad laminates, the diameter of its single fibre is 9 microns, and it is double-drawn on the 800-hole slide plate in the pool kiln, or three-fold on the 1200-hole slide plate, and the rice is used with inserts, spray cooling, and monofilament coating. It is made of oil.
Heaterk welcomes you to discuss the use of E-glass fabrics in various industries with us; get in touch with the team at Heaterk now!